Toolset

Processors:

General purpose processors: Atmel SAMA5D3, Atmel SAM9X, Intel Atom E6xx, Intel Atom E3800, Sitara ARM, Xilinx Zynq-7000, Freescale i.MX6, Samsung Exynos.

Multimedia systems-on-chip: Freescale i.MX6, Samsung Exynos, TI Davinci / Jacinto4.

Specialty processors. Digital signal processing: ADI Blackfin, TI Davinci / Jacinto4, OMAP4, TI KeyStone. Multi-core processors: TI KeyStone, Xilinx Zynq-7000, Adapteva Epiphany, Intel Atom E6xx, Intel Atom E3800, Freescale i.MX6, Samsung Exynos, XMOS xCORE.

Microcontrollers: TI MSP430G2xx, TI Concerto, TI Tiva-C, STMicro STM32F4xx, NXP LPC43xx, Freescale Kinetis.

Hybrid processors: TI KeyStone, Xilinx Zynq-7000, ADI Blackfin, TI Davinci / Jacinto4, OMAP4, TI Concerto.

Architectures:

ARM, SuperH, x86, TI DSP, ADI Blackfin, ADI DSP, AVR32, MSP430; ADI BF50x/BF53x/BF561/BF60x, ADSP-2126x/2127x, ADSP-TS20xS; AMD Geode LXxxx; Altera Cyclone/Stratix/MAX; Atmel AVRx / AT32x / SAM3x / SAM7x / SAM9x / RM9200; Beck IPC SC1x3; Cirrus Logic EP93xx; Intel Atom N270, Atom Z5x0, Intel/Marvell PXA27x / PXA3xx XScale; Freescale i.MX23 / i.MX31 / i.MX51 / i.MX53; NXP LPC1xxx / LPC2xxx / LPC3xxx; NVidia Tegra 240/250; Renesas SH7727; Samsung S3C24xx / S3C64xx / S5PC100 / Exynos 4210; ST Micro STM32 F1/F2 / STR9xx; TI TMS320F283xx; TMS320C55xx, TMS320C64xx, TMS320C674x, Concerto F28M35x, Davinci TMS320DM6467 / DM644x / DM36x, Davinci TMS320DM81xx, OMAP3530/OMAP3730, OMAP4430, Sitara AM335x / AM35xx / AM37xx, Integra OMAP-L13x, Integra TMS320C6A816x; Xilinx Spartan / Virtex / CoolRunner / Zynq / Artix / Kintex;

Components:

3M, Amphenol Connex, Altera, AMD, Aimtec, Analog Devices, Atmel, Beck IPC, Binder Connector, Bolymin, Cirrus Logic, Cypress, Davicom, Digi, Fairchild, Freescale, Fujitsu, Futaba, GEOSTAR, Hitachi, Honeywell, IDT, Infineon, Intel, Intersil, ISSI, JAE, LG, Marvell, Maxim, Micrel, Microchip, Micron, Mitsubishi, Molex, National Semiconductor, NEC, Numonyx, NXP, NVidia, Panasonic, Parallax, Peak, Phoenix Contact, Qualcomm, Qimonda, Ramtron, Realtek, Renesas, Rohm Semiconductor, Samsung, SanDisk, Sanyo, Seiko, Sharp, Siemens, SIMCom, Silabs, SMSC, Sony, STM, ON Semiconductor, Texas Instruments, Toshiba, TranSystem, Tyco Electronics, Varitronix, Wago, Wavecom, Winbond, Winstar, Wiznet, Xilinx, Zilog, НАВИС.

Operational systems:

Embedded Linux, Android, Microsoft Windows Embedded, eCOS, FreeRTOS, ADI VDK, DSP/BIOS. ADI VDK RTOS; eCOS 2.0 / 3.0; FreeRTOS; scmRTOS; TI DSP/BIOS; TI SYS/BIOS; Embedded Linux / uClinux; Google Android; Microsoft Windows Embedded CE; Microsoft Windows Embedded Compact 7; Microsoft Windows Embedded Standard 2009 / 7; Microsoft Windows Embedded POSReady 2009 / 7; Microsoft Windows Embedded Enterprise; Microsoft Windows Embedded Server / SQL Server;

Wireless communications interfaces:

IrDA, Bluetooth, WiFi, GPRS / GSM / 3G / HSPA / LTE / LTE Advanced, ZigBee, GPS;Vishay TFDU61xx / TFBS47xx / TFBS43xx; Marvell Avastar 88W8787 / 88W8686; TSI EB-500, GEOSTAR ГеоС-xx, UBlox LEA-x / NEO-x, Leadtek LR9548S, Telit GM862-GPS; TI ZigBee CC2431; Wavecom WISMO 2x8, M260; Telit GE864, G24-EDGE, HE910-HSPA; Wi2Wi W2CBW00xx.

Communications interfaces:

USB Host/Client/OTG, SPI/SSP, I2C, LVDS, UART, RS232 / 485 / 422, LCD HDMI, DVI, SD / SDHC / MMC / CF / PCMCIA, ATA, SATA, PATA, Ethernet, PoE, PCI, PCIe, 1-Wire, uWire, CAN, SPORT, S/PDIF, PPI, I2S, AC97, TDM, RMII, MII.

Industrial interfaces:

ProfiNET, EtherCAT, ProfiBUS, ModBUS, CANOpen, IEC 61850, MQTT, GigE Vision.

Programming languages:

C/C++ (incl STL/ATL), TCL, CDL, Java (J2ME), MatLab, Mathematica, VHDL/Verilog, ASM, XML, XAML.

Multimedia:

MPEG2, MPEG4, MP3, WMA, H.264, WMV8, JPEG, JPEG2000, Motion JPEG, OGG Vorbis, G.711 u/a-Law, G.722 ADPCM, G.726 ADPCM, Speex, GSM 6.10.

инструментарий и компоненты